While the largest thermal swing occurs at production time, the life cycle of the processor can also contribute to delamination.
Disassembling asus g751jt crack#
The crack pattern is referred to as “Delamination.” Over time these cracks contribute to significant increase in overall thermal resistance of the TIM1 layer. The crack formation resembles that of a layered separation leaving voids where thermal energy cannot transfer. The Shin Etsu paste is easily just as durable in my opinion, as it handles bare die thermal cycles under heavy GPU loads and doesn't pump out over time.ĭue to the the property of the indium based solder, thermal cycling forms microcracks in the solder layer. It's quite a bit more expensive than the Dow Corning that Intel uses, which is likely why they don't use it. Having removed my cooler quite a few times, I have noticed absolutely zero difference between the stock Shin Etsu paste and my Gelid GC Extreme. Shin Etsu has some extremely good blends that are ultra durable AND very good at cooling. If tiny, 4 billion income a year AMD can do it, then gigantic 63 billion income Intel is more than capable of doing it. AMD does it after all, on much more complex cpus. Until they actually prove, via some independant research (or observers, whatever really), that soldering their cpus is actually impossible, I'll keep calling them cheapos. True, I understand that lasting a long time is important too, but I'm sure there's another paste out there that is better than this and last longer too.įor the soldering, it's just down to money at this point.
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